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  d/ 20a t s 12 - 220 1200 v s i/ a t s? 5iode dec 2018 r ev 1.0 www.genesics emi.com/schottky_ mps /gc 20mps 12 s ilicon c arbide s chottky diode f eatures ? high avalanche (uis ) c apability ? e nhanced s urge c urrent c apability ? s uperior f igure of merit q c /i f ? low t hermal r esistance ? 175 c maximum operating t emperature ? t emperature independent s witching behavior ? positive t emperature c oefficient of v f ? e xtremely f ast s witching s peeds advantages ? low s tandby power losses ? improved c ircuit e fficiency (lower overall c ost) ? low s witching losses ? e ase of paralleling without t hermal r unaway ? s maller heat s ink r equirements ? low r everse r ecovery c urrent ? low device c apacitance ? low r everse leakage c urrent abs olute maximum r atings (at t parameter r epetitive peak r everse v oltage c ontinuous f orward c urrent non-r epetitive peak f orward s urge c urrent, half s ine wave r epetitive peak f orward s urge c urrent, half s ine wave non-r epetitive peak f orward s urge c urrent i 2 t v alue non-r epetitive avalanche e nergy diode r uggedness power dissipation operating and s torage temperature www.genesics emi.com/schottky_ mps /gc 20mps 12 - 220.pdf s chottky diode pac kage 175 c maximum operating t emperature t emperature independent s witching behavior f to-220-2 applic ations overall c ost) of paralleling without t hermal r unaway ? boost diode in power f actor c orrection (pf c ) ? s witched mode power s upply (s mp s ) ? uninterruptible power s upply (ups ) ? motor drives ? f reewheeling / anti- parallel diode in inverters ? s olar inverters ? e lectric vehicles (e v ) & c harging ? induction heating & w elding (at t c = 25 c unless otherwise s tated) s ymbol c onditions values v r r m 1200 i f t c = 25 c , d = 1 94 t c = 135 c , d = 1 46 t c = 165 c , d = 1 20 i f ,s m t c = 25 c , t p = 10 ms 120 t c = 150 c , t p = 10 ms 96 i f ,r m t c = 25 c , t p = 10 ms 82 t c = 150 c , t p = 10 ms 55 i f ,max t c = 25 c , t p = 10 s 1100 i 2 dt t c = 25 c , t p = 10 ms 72 e as l = 1 mh, i as = 20 a 220 dv /dt v r = 0 ~ 960 v 100 p tot t c = 25 c 597 t j , t stg - 55 to 175 v r r m i f (tc = 135 c ) q c a k c ase page 1 of 7 boost diode in power f actor c orrection (pf c ) s witched mode power s upply (s mp s ) uninterruptible power s upply (ups ) parallel diode in inverters e lectric vehicles (e v ) & c harging s tations values unit 1200 v a 120 a a 1100 a a 2 s 220 mj 100 v/ns 597 w 55 to 175 c = 1200 v c ) = 46 a = 66 nc
d/ 20a t s 12 - 220 1200 v s i/ a t s? 5iode dec 2018 r ev 1.0 www.genesics emi.com/schottky_ mps /gc 20mps 12 e lectrical c harac teristics parameter diode f orward voltage r everse c urrent total c apacitive c harge s witching time total c apacitance thermal / mec hanical c harac teris tics thermal r esistance, j unction - c ase weight mounting torque www.genesics emi.com/schottky_ mps /gc 20mps 12 - 220.pdf s ymbol c onditions values min. t yp . v f i f = 20.0 a, t j = 25 c 1.5 i f = 20.0 a, t j = 175 c 2 i r v r = 1200 v, t j = 25 c 1.8 v r = 1200 v, t j = 175 c 5.4 q c i f i f ,max di f /dt = 200 a/s t j = 175 c v r = 400 v 54 v r = 800 v 79 t s v r = 400 v < 10 v r = 800 v c v r = 1 v, f = 1 mhz, t j = 25 c 12 98 v r = 800 v, f = 1 mhz, t j = 25 c 83 c harac teris tics r thj c 0.2 2 w t 2 t m 0.8 page 2 of 7 values unit . max. 1.8 v 2.4 18 a 64.8 nc 10 ns 98 pf 2 c /w g nm
d/ 20a t s 12 - 220 1200 v s i/ a t s? 5iode dec 2018 r ev 1.0 www.genesics emi.com/schottky_ mps /gc 20mps 12 i f = f(v f ,t j ); t p = 10 s f ig ure 1: t ypical f orward c haracteristics i r = f(v r ,t j ) f ig ure 3: t ypical r evers e c haracteristics www.genesics emi.com/schottky_ mps /gc 20mps 12 - 220.pdf i f = f(v f ,t j ); t p = 1 f ig ure 1: t ypical f orward c haracteristics f ig ure 2: t ypical hig h c urrent f orward c haracteris tics p tot = f(t c ) f ig ure 3: t ypical r evers e c haracteristics f ig ure 4: power derating c urve page 3 of 7 = 1 0 s f ig ure 2: t ypical hig h c urrent f orward c haracteris tics power derating c urve
d/ 20a t s 12 - 220 1200 v s i/ a t s? 5iode dec 2018 r ev 1.0 www.genesics emi.com/schottky_ mps /gc 20mps 12 i f = f(t c ); d = t p /t , t p = 10 s f ig ure 5: c urrent derating c urves(t q c = f(v r ); t j = 25 c ; f = 1 f ig ure 7: t ypical c apacitive c harge vs voltag e c haracteris tics www.genesics emi.com/schottky_ mps /gc 20mps 12 - 220.pdf = 10 s c = f(v r ); t j = 25 c ; f = 1 f ig ure 5: c urrent derating c urves(t j = 206 c ) f ig ure 6: t ypical j unction c apacitance vs r everse voltag e c haracteris tics mhz e c = f(v r ); t j = 25 c ; f = 1 7: t ypical c apacitive c harge vs r evers e voltag e c haracteris tics f ig ure 8: t ypical c apacitive e nerg y vs voltag e c haracteris tics page 4 of 7 ; f = 1 mhz f ig ure 6: t ypical j unction c apacitance vs r everse voltag e c haracteris tics = 25 c ; f = 1 mhz 8: t ypical c apacitive e nerg y vs r evers e voltag e c haracteris tics
d/ 20a t s 12 - 220 1200 v s i/ a t s? 5iode dec 2018 r ev 1.0 www.genesics emi.com/schottky_ mps /gc 20mps 12 f ig ure 9: t ransient t hermal impedance i f = f(v f , t j ) f ig ure 10 : f orward c urve model www.genesics emi.com/schottky_ mps /gc 20mps 12 - 220.pdf z th,jc = f(t p ,d); d = t p /t f ig ure 9: t ransient t hermal impedance i f = (v f C v bi )/r dif f b uilt-in voltag e (v v bi (t j ) = m*t j + n (v) m = -1.64e- 03, n = 1.01 differential r es istance (r r dif f (t j ) = a*t j 2 + b*t a = 6.30e-07, b = 1.05e- 04, c = 0.0223 : f orward c urve model page 5 of 7 dif f (a) voltag e (v b i ): n (v) 03, n = 1.01 differential r es istance (r dif f ): + b*t j + c (? ); 04, c = 0.0223
d/ 20a t s 12 - 220 1200 v s i/ a t s? 5iode dec 2018 r ev 1.0 www.genesics emi.com/schottky_ mps /gc 20mps 12 pac kage dimens ions t o - 220 - 2l r ecommended s older pad l ayout note 1. c ontr olle d dime ns ion is inc h. dime ns ion in br ac k e t is millime te r . 2. dime ns ions do not inc lude e nd f las h, mold f las h, mate r ial p r ot r us ions www.genesics emi.com/schottky_ mps /gc 20mps 12 - 220.pdf p ac kage o utline 1. c ontr olle d dime ns ion is inc h. dime ns ion in br ac k e t is millime te r . inc lude e nd f las h, mold f las h, mate r ial p r ot r us ions page 6 of 7
d/ 20a t s 12 - 220 1200 v s i/ a t s? 5iode c opyright ? 2018 genes ic s emiconductor inc. all r ig hts r es erved the information in this document is subject to chan g e without notice dec 2018 r ev 1.0 r ohs c ompliance t he levels of r ohs restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted applica tion, in accordance wit h e u directive 2011/65/e c (r ohs this product can be obtained from your genes ic r e ac h c ompliance r e ac h substances of high concern (s vhc s) information is a vailable for this product. s ince the e uropean c hemical agency (e c ha) has published notice of thei r intent to frequently revise the s vhc listing for the foreseeable future, please contact a genes ic declaration. r e ac h banned substance information ( t his product has not been designed or tested for us e in, and is not intended for use in, applicatio the human body nor in applications in which failure of the product could lead to death, personal injur y or property damage, including but not limited to equipment used in the operation of nuclear facilities, life cardiac defibrillators or similar emergency medical equipme nt, aircraft navigation or communication or control systems, or air traffic control systems. genes ic disclaims all and any warranty and liabilit y arising out of use or application of any product. no lice express or implied to any intellectual property rig hts is granted by this document. r elated l inks ? s oldering document: http://www.genesicsemi.com/ ? t in-whisker r eport: http://www.genesicsemi.com/ ? r eliability r eport: http://www.genesicsemi.com/ c opyright ? 2018 genes ic s emiconductor inc. all r ig hts r es erved the information in this document is subject to chan g e without notice genes ic s emiconductor, inc. 43670 trade c enter place s uite 155 restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted applica tion, in h e u directive 2011/65/e c (r ohs ), as implemented november 15, 2017 . r ohs declarations for genes ic representative. substances of high concern (s vhc s) information is a vailable for this product. s ince the e uropean c hemical agency (e c ha) has published notice of thei r intent to frequently revise the s vhc listing for the genes ic representative to insure you get the most up - banned substance information ( r e ac h article 67) is also available upon request. t his product has not been designed or tested for us e in, and is not intended for use in, applicatio the human body nor in applications in which failure of the product could lead to death, personal injur y or property damage, including but not limited to equipment used in the operation of nuclear facilities, life defibrillators or similar emergency medical equipme nt, aircraft navigation or communication or control genes ic disclaims all and any warranty and liabilit y arising out of use or application of any product. no lice express or implied to any intellectual property rig hts is granted by this document. http://www.genesicsemi.com/ technical-support/quality / http://www.genesicsemi.com/ technical-support/compliance/ http://www.genesicsemi.com/ technical-support/reliability/ published by genes ic s emiconductor, inc. 43670 trade c enter place s uite 155 dulles, v a 20166 page 7 of 7 restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted applica tion, in . r ohs declarations for substances of high concern (s vhc s) information is a vailable for this product. s ince the e uropean c hemical agency (e c ha) has published notice of thei r intent to frequently revise the s vhc listing for the - to-date r e ac h s vhc article 67) is also available upon request. t his product has not been designed or tested for us e in, and is not intended for use in, applicatio ns implanted into the human body nor in applications in which failure of the product could lead to death, personal injur y or property damage, including but not limited to equipment used in the operation of nuclear facilities, life -support machines, defibrillators or similar emergency medical equipme nt, aircraft navigation or communication or control genes ic disclaims all and any warranty and liabilit y arising out of use or application of any product. no lice nse,


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